Intel® Core™ i9-10850K Processor
Processor Number
The Intel processor number is just one of respective factors—along with processor post, system configurations, and system-level benchmarks—to be considered when choosing the right central processing unit for your computing needs. Read more about interpreting Intel® central processing unit numbers or Intel® central processing unit numbers for the Data Center .
Lithography
lithography refers to the semiconductor technology used to manufacture an integrate racing circuit, and is reported in nanometer ( new mexico ), indicative of the size of features built on the semiconductor device.
Reading: Intel® Core™ i9-10850K Processor
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific practice condition information, see PRQ report.
For stream use condition information, see Intel UC ( CNDA site ) * .
Total Cores
Cores is a hardware term that describes the number of independent cardinal processing units in a single calculate part ( die or chip ) .
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores .
Max Turbo Frequency
Max Turbo Frequency is the maximal single-core frequency at which the central processing unit is adequate to of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz ( GHz ), or billion cycles per second .
Intel® Thermal Velocity Boost Frequency
Intel® Thermal Velocity Boost ( Intel® TVB ) is a sport that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo ability budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution .
Intel® Turbo Boost Max Technology 3.0 Frequency ‡
Intel® Turbo Boost Max Technology 3.0 identifies the best perform kernel ( s ) on a central processing unit and provides increase performance on those cores through increasing frequency as needed by taking advantage of ability and thermal headroom. Intel® Turbo Boost Max Technology 3.0 frequency is the clock frequency of the CPU when running in this mood .
Intel® Turbo Boost Technology 2.0 Frequency‡
Intel® Turbo Boost Technology 2.0 Frequency is the maximum individual core frequency at which the central processing unit is capable of operating using Intel® Turbo Boost Technology. Frequency is typically measured in gigahertz ( GHz ), or billion cycles per second .
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor ‘s transistors open and cheeseparing. The processor basis frequency is the operating point where TDP is defined. frequency is typically measured in gigahertz ( GHz ), or billion cycles per second .
Cache
CPU Cache is an sphere of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last flush cache .
Bus Speed
A bus is a subsystem that transfers data between calculator components or between computers. Types include front-side bus ( FSB ), which carries data between the CPU and memory accountant hub ; direct media interface ( DMI ), which is a point-to-point interconnection between an Intel desegregate memory control and an Intel I/O control hub on the computer ’ s motherboard ; and Quick Path Interconnect ( QPI ), which is a point-to-point complect between the CPU and the integrated memory accountant .
TDP
Thermal Design Power ( TDP ) represents the average office, in watt, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements .
Configurable TDP-down Base Frequency
Configurable TDP-down Base Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the central processing unit frequency to fixed points. The Configurable TDP-down Base Frequency is where the Configurable TDP-down is defined. frequency is typically measured in gigahertz ( GHz ), or billion cycles per second .
Configurable TDP-down
Configurable TDP-down is a processor operating mode where the central processing unit behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize baron and performance. Configurable TDP-down is the average power, in watt, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload .
Embedded Options Available
Embedded Options available indicates products that offer cover buy handiness for intelligent systems and embedded solutions. Product authentication and use condition applications can be found in the Production Release Qualification ( PRQ ) report. See your Intel example for details .
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the central processing unit .
Memory Types
Intel® processors come in four different types : Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels .
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for actual populace application .
Max Memory Bandwidth
Max Memory bandwidth is the utmost rate at which data can be read from or stored into a semiconductor device memory by the central processing unit ( in GB/s ) .
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of inner data corruption. note that ECC memory subscribe requires both processor and chipset patronize .
Processor Graphics ‡
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, calculate, media, and expose capabilities. Processor graphics brands include Intel® Iris® Xe Graphics, Intel® UHD Graphics, Intel® HD Graphics, Iris® Graphics, Iris® Plus Graphics, and Iris® Pro Graphics. See the Intel® Graphics Technology for more information.
Intel® Iris® Xe Graphics entirely : to use the Intel® Iris® Xe brand, the system must be populated with 128-bit ( double channel ) memory. differently, use the Intel® UHD stigmatize .
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz .
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the utmost opportunist graphics render clock frequency ( in MHz ) that can be supported using Intel® HD Graphics with Dynamic Frequency feature of speech .
Graphics Video Max Memory
The maximum total of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU ( subject to OS, driver, and other system limitations ) .
4K Support
4K support indicates the product ‘s back of 4K resolution, defined here as minimum 3840 x 2160 .
Max Resolution (HDMI)‡
Max Resolution ( HDMI ) is the maximal resolving power supported by the processor via the HDMI interface ( 24bits per pixel & 60Hz ). system or device display resoluteness is dependant on multiple system design factors ; actual resolution may be lower on your system .
Max Resolution (DP)‡
Max Resolution ( DP ) is the maximum resoluteness supported by the processor via the DP interface ( 24bits per pixel & 60Hz ). organization or device display resolution is dependent on multiple system design factors ; actual resolution may be lower on your system .
Max Resolution (eDP – Integrated Flat Panel)‡
Max Resolution ( Integrated Flat Panel ) is the maximal resolution supported by the central processing unit for a device with an integrate flat panel ( 24bits per pixel & 60Hz ). system or device display resolving power is subject on multiple system design factors ; actual resolution may be lower on your device .
DirectX* Support
DirectX* Support indicates accompaniment for a specific interpretation of Microsoft ’ s collection of APIs ( Application Programming Interfaces ) for handling multimedia calculate tasks .
OpenGL* Support
OpenGL ( Open Graphics Library ) is a cross-language, multi-platform API ( Application Programming Interface ) for rendering 2D and 3D vector graphics .
Intel® Quick Sync Video
Intel® Quick Sync Video delivers fast conversion of video recording for portable media players, online sharing, and video edit and author .
Intel® InTru™ 3D Technology
Intel® InTru™ 3D Technology provides stereoscopic three-d Blu-ray* playback in wax 1080p resolving power over HDMI* 1.4 and premium audio .
Intel® Clear Video HD Technology
Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of persona decode and action technologies built into the integrated processor graphics that improve video playback, delivering blank, sharper images, more natural, accurate, and bright colors, and a clear and stable video recording word picture. Intel® clear Video HD Technology adds television timbre enhancements for richer color and more realistic hide tones .
Intel® Clear Video Technology
Intel® Clear Video Technology is a suite of visualize decode and process technologies built into the integrated processor graphics that improve video recording playback, delivering clean, sharper images, more natural, accurate, and intense colors, and a clear and stable video picture .
PCI Express Revision
PCI Express Revision is the supported interpretation of the PCI Express standard. peripheral Component Interconnect Express ( or PCIe ) is a high-speed consecutive calculator expansion bus topology standard for attaching hardware devices to a calculator. The different PCI Express versions support different data rates .
PCI Express Configurations ‡
PCI Express ( PCIe ) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices .
Max # of PCI Express Lanes
A PCI Express ( PCIe ) lane consists of two differential gear signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe busbar. Max # of PCI Express Lanes is the total number of supported lanes .
Sockets Supported
The socket is the part that provides the mechanical and electrical connections between the processor and motherboard .
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this processor .
Intel® Thermal Velocity Boost Temperature
thermal Velocity Boost ( Intel® TVB ) temperature is the operate temperature terminus ad quem to enable the Intel® TVB frequency ; higher temperatures may opportunistically enable the Intel TVB frequency .
TJUNCTION
junction temperature is the maximum temperature allowed at the central processing unit die .
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storehouse to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of repositing while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for shape requirements .
Intel® Thermal Velocity Boost
Intel® Thermal Velocity Boost ( Intel® TVB ) is a feature of speech that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the central processing unit is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is pendent on the workload, capabilities of the processor and the processor cooling solution .
Intel® Turbo Boost Max Technology 3.0 ‡
Intel® Turbo Boost Max Technology 3.0 identifies the best perform core ( s ) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom .
Intel® Turbo Boost Technology ‡
Intel® Turbo Boost Technology dynamically increases the processor ‘s frequency as needed by taking advantage of thermal and power headroom to give you a explode of speed when you need it, and increased energy efficiency when you don ’ thyroxine .
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology ( Intel® HT Technology ) delivers two processing threads per physical core. Highly threaded applications can get more work done in twin, completing tasks sooner .
Intel® Transactional Synchronization Extensions
Intel® Transactional Synchronization Extensions ( Intel® TSX ) are a determined of instructions that add hardware transactional memory support to improve performance of multi-threaded software .
Intel® 64 ‡
Intel® 64 architecture delivers 64-bit computing on waiter, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 computer architecture improves performance by allowing systems to address more than 4 GB of both virtual and forcible memory .
Instruction Set
An teaching set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel ’ s teaching set this central processing unit is compatible with .
Instruction Set Extensions
education Set Extensions are extra instructions which can increase operation when the same operations are performed on multiple data objects. These can include SSE ( Streaming SIMD Extensions ) and AVX ( Advanced Vector Extensions ) .
Idle States
baseless States ( C-states ) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing utilitarian work. C1 is the first idle state of matter, C2 the second, and so on, where more world power economy actions are taken for numerically higher C-states .
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. conventional Intel SpeedStep® Technology switches both voltage and frequency in bicycle-built-for-two between high and broken levels in reception to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using blueprint strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery .
Thermal Monitoring Technologies
thermal Monitoring Technologies protect the processor package and the system from thermal failure through respective thermal management features. An on-die Digital Thermal Sensor ( DTS ) detects the congress of racial equality ‘s temperature, and the thermal management features reduce package power pulmonary tuberculosis and thereby temperature when required in orderliness to remain within normal operating limits .
Intel® Identity Protection Technology ‡
Intel® Identity Protection Technology is a built-in security keepsake technology that helps provide a elementary, tamper-resistant method for protecting entree to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique exploiter ’ s personal computer to websites, fiscal institutions, and network services ; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and clientele log-ins .
Intel vPro® Platform Eligibility ‡
The Intel vPro® platform is a jell of hardware and technologies used to build occupation computing endpoints with bounty operation, built-in security, mod manageability and platform constancy.
Learn more about Intel vPro®
Intel® AES New Instructions
Intel® AES New Instructions ( Intel® AES-NI ) are a set of instructions that enable fast and secure data encoding and decoding. AES-NI are valuable for a wide-eyed scope of cryptanalytic applications, for exemplar : applications that perform bulk encryption/decryption, authentication, random count generation, and attested encoding .
Secure Key
Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encoding algorithm .
Intel® Software Guard Extensions (Intel® SGX)
Intel® Software Guard Extensions ( Intel® SGX ) provide applications the ability to create hardware enforced believe execution protective covering for their applications ’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trust execution environments ( TEE ’ sulfur ) .
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer calculation is a versatile plant of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protect performance. It enables an environment where applications can run within their own space, protected from all early software on the system .
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or net .
Intel® Boot Guard
Intel® Device Protection Technology with Boot Guard helps protect the system ’ mho pre-OS environment from viruses and malicious software attacks .
Intel® Stable IT Platform Program (SIPP)
The Intel® Stable IT Platform Program ( Intel® SIPP ) aims for zero changes to key platform components and drivers for at least 15 months or until the following generational unblock, reducing complexity for IT to effectively manage their calculate endpoints.
Learn more about Intel® SIPP
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology ( VT-x ) allows one hardware chopine to function as multiple “ virtual ” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into classify partitions .
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O ( VT-d ) continues from the existing support for IA-32 ( VT-x ) and Itanium® central processing unit ( VT-i ) virtualization adding new accompaniment for I/O-device virtualization. Intel VT-d can help end users improve security and dependability of the systems and besides improve performance of I/O devices in virtualized environments .
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® VT-x with Extended Page Tables ( EPT ), besides known as irregular Level Address Translation ( SLAT ), provides acceleration for memory intensive virtualized applications. Extended page Tables in Intel® Virtualization Technology platforms reduces the memory and might overhead costs and increases battery life through hardware optimization of page mesa management .